Job descriptionthis role is focused on manufacturing process performance, defect detection, and root cause analysis—not product design or electrical testing.responsible for analyzing, improving, and validating soldering and welding processes in power electronics manufacturing through hands-on failure analysis, cross-sectioning techniques, and advanced inspection systems (aoi/axi).responsibilitieskey responsibilitiesperform hands-on cross-sectioning and solder/welding joint analysis to evaluate solder quality, identify defects (voids, cracks, insufficient wetting, etc.), and support root cause investigations.operate and interpret results from aoi (automated optical inspection) and axi (x-ray inspection) systems to detect and classify soldering defects in power electronics assemblies.analyze welding & soldering processes (selective soldering, reflow, or similar) ensuring robust and repeatable manufacturing performance.perform mechanical validation of solder joints, including pull/shear or tensile-type evaluations when applicable.lead failure analysis activities using laboratory equipment (cutting, mounting, polishing, microscopy) to determine defect origin and drive corrective actions.correlate inspection findings (aoi/axi) with physical analysis (cross-sections, intermetallic evaluation) to validate defect mechanisms and process gaps.support continuous improvement initiatives focused on defect reduction, yield improvement, and process stability.work closely with manufacturing, quality, and supplier teams to ensure process alignment and defect containment.define and standardize inspection criteria and acceptance thresholds for solder joints in power electronics products.qualificationseducation: bachelor's degree in engineering (mechanical, electrical, manufacturing, mechatronics, or related field).required qualificationsstrong hands-on experience with cross-sectioning and solder joint analysis, including intermetallic evaluation and void detection.proven experience using aoi and axi inspection systems (defect detection, programming, interpretation of results).experience in failure analysis and root cause investigation in a manufacturing environment.hands-on experience with laboratory equipment for sample preparation, including:precision cutting toolsdiamond sawswaterjet cuttingwire edm cuttingmounting and polishing equipmentexperience performing or supporting mechanical testing of solder joints (pull, shear, or tensile methods).ability to define cutting and preparation methodologies for new product introductions (npi).experience working in production environments with a focus on quality and process improvement.preferred qualificationsexperience in high-reliability or automotive power electronics manufacturing.knowledge of ipc standards (e.g., ipc-a-610, ipc-*).experience correlating process parameters with defect generation.exposure to continuous improvement methodologies (six sigma, etc.).inspection & process expertisedemonstrated experience validating and analyzing soldering and welding processes using laboratory and inline inspection systems (aoi, axi, ct inspection), including:vacuum solderingct inspection and defect analysissolder wetting evaluationvoid detection and analysisbond line thickness controlexcess solder / solder bleed-out identificationlaser weldingdestructive validation methodsweld depth penetration analysisweld length verificationweld inspection area definition and validationselective solderingpin protrusion evaluationpercentage of land area covered with wetted solder on secondary side (solder source side)wetting on solder source side of lead and barrelexcess solder defects (solder balls)bridging defectssolder webbing / splashessolder fracture / blow holessolder connection wetting angle evaluationnon-wetting conditionssolder volume controlvertical fill validationlanguage skills: advanced proficiency in english (written and verbal) to support global reporting, technical documentation, and cross-functional collaboration.#j-*-ljbffr