Failure analysis engineer position summary
the failure analysis engineer is responsible for identifying, analyzing, and determining the root causes of failures in electronic components, assemblies, and systems. This role plays a critical part in improving product reliability, supporting manufacturing operations, and driving continuous improvement initiatives across the organization. The ideal candidate has strong analytical skills, hands‐on laboratory experience, and a solid understanding of electronics, materials, and semiconductor technologies.
key responsibilities failure analysis & investigation
* perform detailed electrical, mechanical, and material-level investigations to determine root causes of component or system failures.
* use analytical tools such as x‐ray, sem/eds, sam, optical microscopy, ftir, xrf, tdr, oscilloscopes, and curve tracers.
* conduct destructive and non-destructive testing of electronic components, pcbs, and assemblies.
* develop comprehensive fa reports with clear findings, conclusions, and recommendations.
root cause & corrective action (rcca)
* utilize methodologies such as 5 why, fishbone, 8d, fmea to drive structured problem-solving.
* collaborate with engineering, quality, and manufacturing teams to implement corrective and preventive actions.
* support product reliability improvement initiatives through trend analysis and risk identification.
product & process support
* provide fa support for customer returns (rma), production issues, reliability testing, and new product introduction (npi).
* analyze failure trends and communicate findings to cross‐functional teams for continuous improvement.
* work closely with suppliers to address component‐level defects or process issues.
documentation & communication
* create and maintain detailed documentation of fa procedures, test results, and recommendations.
* present findings to engineering teams, leadership, and customers as needed.
* ensure all analyses follow industry standards (ipc, jedec, iso, etc.).
qualifications education
* bachelor's degree in electrical engineering, electronics engineering, materials science, physics, or related field.
* master's degree preferred (optional).
experience
* 2+ years of experience in failure analysis, reliability engineering, electronics manufacturing, or semiconductor environment.
* experience working in a high‐volume electronics or components manufacturing environment preferred.
technical skills
* strong understanding of electronic components (ics, passives, pcbs, power electronics, sensors).
* skilled in fa tools: sem/eds, x‐ray, sam, oscilloscopes, curve tracers, thermal imaging, etc.
* familiar with reliability testing methods (halt, hass, htol, burn‐in, thermal cycling).
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