If you are looking for a challenging and exciting career in the world of technology, then look no further.
skyworks is an innovator of high performance analog semiconductors whose solutions are powering the wireless networking revolution.
at skyworks, you will find a fast-paced environment with a strong focus on global collaboration, minimal layers of management and the freedom to make meaningful contributions in a setting that encourages creativity and out-of-the-box thinking.
we are excited about the opportunity to work with you and glad you want to be part of a team of talented individuals who together can change the way the world communicates.
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description
position summary
we are seeking a highly technical and detail-oriented competitive analysis engineer to support skyworks' msb competitive benchmarking activities.
this engineer will be responsible for end-to-end teardown execution, including phone-level and module-level disassembly, competitive cost/architecture analysis, bench measurements, and contribution to plm-driven strategic insights.
location
mexicali, mexico
report to
msb competitive analysis leader (located in newbury park, ca)
responsibilities
primary responsibilities
generate module-level competitive comparisons covering architecture choices, technology nodes, die areas, assembly rules, and cost implications.
perform bench measurements of publicly available competitor products and compare them against skyworks products, identify performance gaps, and communicate them to design engineering.
data automation - develop scripts/tools to automate the analysis of cost, die size, and other competitor data points
perform physical teardown of phones, modules, and rf front-end components, including careful opening and documentation.
collaborate closely with plm, de, tmg, packaging, and fa labs to ensure complete and consistent teardown outputs.
support plm in identifying trends in foundry usage, packaging, osat partners, and competitor design evolution.
close collaboration with fa team on executing back-lapping, decap, imaging, measurement, and data capture.
prepare clear ppt summaries communicating findings to engineering and plm leadership.
required experience and skills
minimum qualifications
bsee + 10 years relevant experience.
strong hands-on skills with electronic assemblies, microscopes, and measurement tools.
experience in semiconductor components, rf fe modules, or failure analysis.
desired experience and skills
preferred qualifications
experience with rf block diagrams, teardown analysis, or competitor benchmarking.
familiarity with sem/x-ray imaging, cross-sectioning, and die-level analysis.
knowledge of plm workflows, cost modeling, or should-cost analysis.
advanced excel, data analytics, or scripting for competitive database contributions.
skills
reliability engineering testing and destructive analysis, rf measurements, understanding of rf systems.
education
bachelor's or master's degree in electrical engineering and/or software engineering
travel involved
*% traveling to the us.
skyworks is proud to be an equal opportunity employer supporting diversity in the workplace.
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